Professor Rao Tummala
Prof. Rao Tummala is a Distinguished and Endowed -Chair Professor Emeritus at Georgia Tech in USA. He is well known as an industrial technologist, technology pioneer, and educator. Prior to joining Georgia Tech, he was an IBM Fellow, pioneering such major technologies as the industry’s first plasma display and industry’s first 100-chip-on- a substrate electronics hardware for inevitable replacement of Moore’s Law. He invented many interconnect technologies for high-performance computers. As an educator, Prof. Tummala was instrumental in setting up the largest Academic Center in System-On-Package vision for Electronic Systems, funded by NSF as the first and only NSF Engineering Research Center in US at Georgia Tech. The Center with its integrated approach to research, education and global industry collaborations, with more than 200 companies in US, Europe, Japan, Korea, Taiwan, India and China, produced more than 600 Ph.Ds to supply to all the major electronic companies in US. He is a consultant to many High Tech companies in US, Europe and Japan. He received more than 50 industry, academic and professional society awards including Distinguished Alumni of Indian Institute of Science, U of Illinois and the highest Faculty award from Georgia Tech—The Distinguished Faculty. He has published about 800 technical papers and invented many technologies that resulted in over 110 patents. He wrote the first modern textbook in packaging, Microelectronics Packaging Handbook(1988); wrote the 1st undergrad textbook, Fundamentals of Microsystem Packaging(2001); and the 1st book introducing the concept of SOP, Introduction to System-on-Package( 2006). He was the Past President OF IEEE CPMT and IMAPS societies. He is an IEEE Fellow and member of National Academy of Engineering in US and in India.